Chinese Chipmaker Loongson To Launch 32-Core 3D5000 Chiplet CPU For Servers In 2023

Chinese chipmaker Loongson has successfully validated its next generation 32-Core 3D5000 CPUs that use microchip architecture and launch in 2023.

Loongson develops 32-core 3D5000 server CPU targeting Chinese domestic server market, total cache size 64MB with proprietary designs

With limited access to China for materials, particularly in the manufacture of next-generation CPUs, Loongson Technology has had to adapt to new technologies, such as chip-based designs. The company has developed a new chip, the 3D5000 CPU, which uses the chiplet design and provides 32 cores for use in various server configurations.

The 3D5000 is part of a long line of processors released by the company. The pre-designed 3C5000 processor currently in use uses sixteen LA464 cores. The core of Loongson Technology’s “LA” is a proprietary microarchitecture called LoongArch that is part of the Godson III series. The 3C5000 has a total cache size of 64MB, and has four 64-bit DDR4 memory interfaces with a bandwidth of 3200MHz and ECC support.

Loongson Technology uses two 3C5000 processors to develop a 32-core 3D5000 server-based CPU. The highest base layout on a server that can use Loongson Technology’s 3D5000 CPU is one that provides 128 cores and consumes power levels between 130 to 170W and bandwidth between 2.00 to 2.20GHz, respectively. The new processor provides eight memory lanes with support for up to four-way multiprocessor configurations in its single design.

The SPEC CPU 2006 benchmark is a CPU benchmark application suite that drives the processor to evaluate its performance and includes a compiler and memory subsystem. It is an industry standard processor test. The Loongson 3D5000 was recently tested and benchmarked, with scores of 400 points on the SPEC CPU 2006 benchmark in the core tests and over 800 points in the benchmark using a 32-core bi-directional configuration. It would make sense for the company to eventually exceed 1,600 points in a four-way configuration, but it hasn’t been tested at the time of writing.

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Loongson had difficulty manufacturing the latest chips, especially with their multi-core designs and lack of access to materials. As the materials are rarer, Loongson has turned towards chip-tech designs. SMIC, the Loongson chip maker, has been slow to adopt entirely new modular technology, unlike TSMC. This puts the company at a disadvantage as it cannot compete with major technology manufacturers such as the leading Intel and AMD.

Loongson Technology began the process of shipping new processors during the first half of the following year, with the following commercial models coming soon.

News sources: Loongson Technology, Finance.Sina

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